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JEET, Vol. 11, No. 1, January 2016
Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures
M. Sindhadevi
Area C - Electrophysics and Applications
Abstract This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of -40dB in Near-End Crosstalk (NEXT) and -60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.
Keyword High speed interconnects,Electromagnetic Band Gap Structures (EBG),Near-End Crosstalk (NEXT),Far-End Crosstalk (FEXT),Signal Integrity (SI),Eye Pattern (EP),Time Domain Reflectometry (TDR)
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